Publications

Pictured

Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

Publications

Microelectronics - Bonded Wafer

MUF and wafers get new acoustic tool
As published in Silicon Semiconductor Issue VI 2013
Matched Tools for Acoustic Micro-Imaging
As published in Evaluation Engineering, Feb 2016
Warped Wafers Flattened Acoustically
As published in Chip Scale Review, Jan/Feb 2016
Automating C-SAM Process Control from Lab to Fab to Backend (PDF)
As Presented at SMTA China 2014
Acoustic Imaging of MEMs Wafers and Devices
As published in Sensors Magazine, Sep 2012
Looking Acoustically into MEMs Devices
As published in EE Times-Asia, Jun 2010
Bonded Wafer Yield Increased by Acoustic Imaging (PDF)
As Presented in Wafer and Device Packaging 2010
Imaging Bonded Wafer Defects for 3D (PDF)
As Presented in Semiconductor International 2009
High-Frequency Acoustic Microscopy Studies of Buried Interfaces in Silicon (PDF)
As Presented at ECTC 2006
Acoustic Micro Imaging in the Fourier Domain for Evaluation of Advanced Packaging (PDF)
As Presented at Pan Pac January 2002
Development of a Resolution Test Wafer for Use in Acoustic Microscopy of Microelectronic Devices (PDF)
As Presented at Pan Pac January 2004
Early Boost to Yields (PDF)
As Published in European Semiconductor September 2001
Checking for Wafer-to-Wafer Bonding Integrity (PDF)
As Published in Electronics Engineer December 1999
Evaluation of Silicon on Insulator (SOI) Bonded Wafers Using Automated Acoustic Micro Imaging (PDF)
As Presented at Pan Pac January 2001
Management of Voids in Processing of Bonded Wafers (PDF)
As Published in Sonoscan White Paper October 2002
Checking for Wafer-to-Wafer Bonding Integrity (PDF)
As Published in Electronics Engineer December 1999

Microelectronics - Chip Capacitor

Acoustically Guided Destructive Physical Analysis
As published in Product Development and Design April 2017
Deeply Diagnostic Acoustic Imaging
As published in Circuits Assembly, Jun 2016
Acoustic Micro Imaging of MLC and Polymer Capacitors
As Published in SMT Magazine June 2013
Acoustic Inspection of Square-Section Capacitors
As Published in Passive Component January/February 2007
Achieving Long-Term Reliability in Chip Capacitors
As Published in Evaluation Engineer November 2001
Acoustic Imaging of Capacitor Cracks Caused at Singulation (Korean Language)
As Presented at SMT Korea November 2006
Acoustic Imaging and Screening of Ceramic Chip Capacitors
As Presented at Passive Component Industry August 2002
Shadows Indicate Cracks
As Published in EPP Europe May/June 2007

Microelectronics - Chip Scale Package

Chip-Scale Packages: Inspection Methods for Diverse Designs
As Published in Electronics Engineer Nov 1997
CSP and Micro-BGA Process and Damage Assessment with Acoustic Micro Imaging
As Presented at SMTA September 2000

Microelectronics - Flip Chip

High Voltage Ceramic Chip Capacitors Evaluation
As published in Bodos Power March 2017
FlipChips: Simultaneous Multi-Gate Acoustic Imaging
As published in Electronic Product and Design, Sep 2015
Advanced Acoustic Methods for Locating Flip Chip Faults
As published in Circuits Assembly, Jun 2015
Designing for Inspection By an Acoustic Micro Imaging Tool
As Published in Product Design and Development March 2015
Nondestructive Method of TIM Bondline Measurement in Flip Chip Package
As Published by H.C. Heng, V.S. Ben, K.H. Keok and J. Riemer
Inverted Acoustic Systems Cut IBGT Failures
As Published in Power Electronics Sept 2011
Flip Chip Failure Mechanisms Detected with AMI
As Presented at Pan Pac 2010
Optimizing Processes and Materials for Flip Chip Reliability
As Published in Circuits Assembly February 2004
Evaluation Of Underfill In Flip Chip And BGA On PC Boards Using 3v Reconstruction, Through Transmission Imaging
As Presented at Pan Pac January 2000
Characterization of Flip Chip Bump Failure Modes Using High Frequency Acoustic Micro Imaging
As Presented at Interconnection June 1997
Characterization of Flip Chip Interconnect Failure Modes Using High Frequency AMI with Correlative Analysis
As Presented at IRPS April 1997
Diagnosing and Avoiding Flip Chip Packaging Defects
As Published in Evaluation Engineer November 2001
Flip Chips and AMI: An Overview of Past Applications, Present Status, and Roadmap for the Future
As Presented at ESREF October 2000
High Frequency AMI for Process Monitoring and Quality Control in Flip Chip Underfill Assembly
As Presented at APEX March 2000
Flip Chips and AMI: An Overview of Past Applications, Present Status, And Roadmap for the Future
As Presented at IAMIS March 2000
Evaluation of Chip Scale Packaging Using AMI: An Overview of Applications, Limitations and Directions for Future Developments
As Presented at Pan Pac January 1998
Flip Chips and AMI: An Overview of Past Applications, Present Status, And Roadmap for the Future
As Presented at SMTA September 2000
Cleaning Up the Flip-Chip Production Act
As Published in Printed Circuit Fabrication May 2001
Cleaning Up the Flip-Chip Production Act
As Published in Printed Circuit Fabrication January 2001
Preventing Flip-Chip Solder Joint Failures
As Published in High-Density Interconnect June 2001
Flip Chip Solder Joint Failures
As Published in High-Density Interconnect January 2001
Preventing Flip-Chip Solder Joint Failures
As Published in High-Density Interconnect August 2001
In Situ Elastic Property Characterization of Flip-Chip Underfills
As Presented at IEPS May 1998
Exploring the Flip Chip to Achieve High Reliability
As Published in Medical Electronics Manufacturing October 2000
Metrology of Thin Layers in IC Packages Using an Acoustic Microprobe: Bondline Thickness
As Presented at ECTC June 1999
Acoustic Micro Imaging in the Fourier Domain for Evaluation of Advanced Packaging
As Presented at PanPac January 2002
Application Of Highly Focused, High Frequency Transducers for Evaluation of Near-Surface Flaws and Thin Packages: Smart Cards, Flip Chip, Flex Circuits and Thick Films
As Presented at Pan Pac January 1999
Evaluation of Lead-Free Solder Bonds and Effects of the Lead-Free Process on Devices Using AMI
As Presented at SMTAI September 2003
Analysis of a Previously Shipped Part - The Virtual Sample
Sonoscan White Paper February 2002
Nondestructive Bondline Measurement in Advanced Flip Chips
As published on www.ap.pennnet.com, Advanced Packaging Industry News January 2008
Method for Automated Nondestructive Analysis of Flip Chip Underfill
As distributed at the International Conference on Soldering and Reliability May 2008

Microelectronics - Hybrid/MCM/SIP

Light & Sound: LEDs seen acoustically
As published in Solid State Technology, Sep 2016
Solar Panels-Faster Acoustic Inspection
As published in Solar Power Management.net, Dec 2015
Acoustic imaging keeps HB-LEDs cool
As published in Global LEDs, Winter 2012
Unveiling structural anomalies in LEDs
As published in Compound Semiconductor, Oct 2012
Listening for long term success
As published in Solar International, Issue IX 2012
Advancements in High Frequency, High Resolution Acoustic Micro Imaging for Thin Silicon Applications
As Presented at Pan Pac January 2011
Acoustic Microscopy Analysis of Die Attached for Satellite Applications
As Presented at ASNT June 1997
Acoustic Evaluation of Heat Sink Attachment
As Published in Power Systems Design Europe February 2004
Application of Highly Focused, High Frequency Transducers for Evaluation of Near-Surface Flaws and Thin Packages: Smart Cards, Flip Chip, Flex Circuits and Thick Films
As Presented at Pan Pac January 1999
Using Acoustic Micro Imaging to Inspect MCMS
As Published in Electronics Engineer April 1996
Quality Assurance for Multichip Modules with AMI Techniques
As Presented at Euro ISHM October 1998
Capabilities of Acoustic Micro Imaging (AMI) For Opto-Electronic Packaging
As Presented at Opto October 2003
Evaluation of Lead-Free Solder Bonds and Effects of the Lead-Free Process on Devices Using AMI
As Presented at SMTAI September 2003
Nondestructive Bondline Measurement in Advanced Flip Chips
As published on www.ap.pennnet.com, Advanced Packaging Industry News January 2008

Microelectronics - IGBT Power Modules

Acoustic Imaging Techniques Map Coutours
As published in AMP, June 2015
Looking Acoustically into Power Modules
As published in Power Electronics, November 2016
Automated Acoustic Inspection for IGBT Modules
As Published in Bodo's Power Systems Dec 2014
IGBT Modules Benefit from Inverted Acoustic Inspection
As Published in Bodo's Power Systems Dec 2013
Surface Flatness and Bond Thickness Measurement Methods Using the Acoustic Microscope
As Presented at SMTAI Sept 2012
Acoustic Determination of IGBT Module Solder Thickness
As Published in Bodo's Power Systems May 2012
Inspecting IGBT Modules - Ultrasound or X-Ray
As Published in Bodo's Power Systems Oct 2011
Acoustic Flatness Measurement Enhances Die Attach Analysis of Power Devices
As Published in Bodo's Power Systems Feb 2010
Power Module Reliability
As Published in Bodo's Power Systems Dec 2009
Thermal Impedance Monitoring during Power Cycle Tests
As Presented at PCIM 2011
Acoustic Imaging for IGBT Reliability
As Published in Bodo's Power Systems Dec 2010
IGBT Modules for Electric Hybrid Vehicles
As Published in Fuji Electric Review Vol. 53, No. 3

Microelectronics - Plastic IC Packaging/PEM

Acoustic Imaging and Inspection
As published in Chip Scale Review October 2013
Fine Tuning Acoustic Screening PEMs
As published in Circuits Assembly May 2013
Microchips in a plastic housing
As published in High Technology magazine, March 2016
Post-Reflow Acoustic Micro Imaging
As published in US Tech, December 2016
Acoustic Screen and Analysis of PEMs for Medical Applications
As published in MDDI online, Aug 2013
Looking Acoustically at MLCCs
As Published in Ceramics Industry Sept 2010
Preventing MLCC Failures
As Published in Circuit Assembly Aug 2009
Identifying IC Package Anomalies with Acoustic Solids
As Published in Electronics Engineer January 1999
Removing Hidden Internal Packaging Defects from Production
As Published in US Tech Nov/Dec 1999
The Moisture Sensitivity Standard Goes Pb-Free (PDF)
As Published in Circuits Assembly January 2007
Nondestructive Elastic Property Characterization of IC Encapsulants
As Presented at ASME IMECE November 1997
Acoustic Micro Imaging Finds Hidden Defects
As Published in US Tech January 2001
Systems Designers Should Take Care when Specifying Plastic Parts in Military Electronics.
As Published in Military Aerospace August 2000
Towards a Nondestructive Procedure for Characterization of Molding Compounds
As Presented at IRPS October 1997
Evaluation of Thin Plastic Packages Using Acoustic Micro Imaging
As Presented at Semi Test August 1996
Reclamation Keeps the Wheel Turning
As Presented at EPP Europe February 2004
Case Studies In the Evaluation of Moisture Sensitive Level (MSL) and Reliability of Devices for High Reliability Applications
As Presented at SMTAI September 2003
Evaluation of Lead-Free Solder Bonds and Effects of the Lead-Free Process on Devices Using AMI
As Presented at SMTAI September 2003
Evaluation of Pb-Free TSOP Devices (Korean Language)
As Presented at SMT Korea October 2004
Evaluation of Stacked Die Packages Using Acoustic Micro Imaging
As Presented at Pan Pac February 2005
Evaluation of Stacked Die Packages Using Acoustic Micro Imaging
As Presented at Pan Pac January 2005
Acoustic Detection of Package Contamination
As Published in Semiconductor International April 2007

Microelectronics - Plastic IC Packaging/PEM/BGA

MLCCs imaging acoustically
As published in Electronic Product and Design, May 2016
Imaging tomorrow's components, acoustically
As Published in Solid State Technology March 2015
BGAs Imaged and Analyzed Acoustically
As Published in Global SMT and Packaging SE Asia Sept/Oct 2014
Testing Epoxy Fluxes for Hearing Aid Miniaturization
As Published in Medical Design and Technology Aug 2014
First 2.5D Acoustic Imaging
As Published in Solid State Tech May 2013
Acoustic Inspection of Mil/Aero Molded Underfill Flip Chips
As Published in SMT Magazine April 2012
Ultrathin, Stackable QFN Packages
As Published in Packaging Article Tools Dec 2009
Avoiding Mismatch in PoP Assembly - New acoustic method examines warped BGAs
As Published in EPP Europe Sept 2009
Finding Singulation Caused Crack in MLCC
As Published in US Tech Online March 2008
Identifying IC Package Anomalies with Acoustic Solids
As Published in Electronics Engineer January 1999
Analysis of BGA and Other Area Array Packaging Using Acoustic Micro Imaging
As Presented at Pan Pac January 1996
Evaluation of Underfill In Flip Chip and BGA On PC Boards Using 3v Reconstruction And Through Transmission
Imaging (PDF)
As Presented at Pan Pac January 2000
Acoustic Micro Imaging in the Fourier Domain for Evaluation of Advanced Packaging
As Presented at Pan Pac January 2002
Swift Acoustic Inspection Rescues BGAs
As Presented at EP&P October 2002

Microelectronics - Printed Circuit Board

Two Imaging Modes Lighten the Inspection Load
As published in Evaluation Engineering December 2016
Risky Components Removed by Ultrasound
As Published in U.S. Tech August 2014
Size Up Component Defects Nondestructively
As published in US Tech, Aug 2013
Process Control Inspection of Surface Mounted Components Using Acoustic Mirco Imaging
As Presented at SMTA Int'l 2011
Evaluation of Underfill in Flip Chip and BGA on PC Boards Using 3v Reconstruction and Through Transmission
Imaging (PDF)
As Presented at Pan Pac January 2000
Acoustic Tools and Applications for PCB Inspection
As Published in EP&P November 2001
Acoustic Micro Imaging Finds Hidden Defects
As Published in US Tech January 2001
Case Studies in the Evaluation of Moisture Sensitive Level (MSL) and Reliability of Devices for High Reliability (High-Rel) Applications
As Presented at SMTAI September 2003
An Overview of Solder Bond Evaluation in Electronics Applications Using Acoustic Micro Imaging
As Presented at Afeit-Brasage September 2001

Microelectronics - Smart Card

Acoustic Imaging of Embedded ICS
As Published in SMT January 2007

Microelectronics - Stacked Die

Non-destructive inspection for heat sink efficiency
As published in Adhesives and Sealants, June 2017
How Acoustic Microscopes Became Smart
As Published in US Tech March 2014
SonoSim Takes Mystery Out of Stacked Die
As Published in MEPTEC Winter Edition 2012
Defect Detection in die stacks with acoustic imaging
As published in Solid State Technology, Sep 2012
Acoustic Micro Imaging of a Stacked Die
As Published in Semiconductor Int’l June 2005
Evaluation of Stacked Die Packages Using Acoustic Micro Imaging
As Presented at Pan Pac January 2005
Update on the Evaluation of Stacked Die Packages Using Acoustic Micro Imaging
As Presented at Pan Pac January 2008

Materials - Composite

Multi-Layer and 3D Acoustic Imaging of Ceramics
As published in Ceramic Industry, Feb 2016
How to Detect Laser-Weld Defects in Pacemaker Casings
As Published in MDDI Jan 2015
High Acoustic Frequency Imaging
As published in Ceramic Industry, Feb 2014
Voids in Electronic Parts Yield to Ultrasound
As published in Advanced Materials and Processes, Jun 2013
Using Ultrasound Technology to Improve Device Reliability
As Published in EMDT Sept 2010
Acoustic Micro-Imaging of Metal Foam Bonds
As Published in AMP Aug 2010
Detecting Flaws in Medical Devices with Acoustic Micro-Imaging
As Published in AMP March 2010
Eliminating Electronic Failure is about the Little Things
As Published in Medical Design March 2010
Depth by Depth Acoustic Investigations
As Published in AMP May 2009
Acoustic Verification of Composites
As Published in AMP March 2007

Materials - Counterfeit Detection

Acoustic Screening to Remove Suspect Plastic Components
As Published in Circuits Assembly Nov 2011
Counterfeit Components and Detection Technology
As Published in Engineer's Guide to Military and Aerospace Technologies Sept 2011
Dodging Counterfeit Electronic Components is Far More Difficult Than in the Past
As Published in Medical Electronics Design April 2011
Identifying Counterfeit Parts
As Published in Circuits Assembly June 2010
Finding Counterfeit with Ultrasound
As Published in US Tech May 2010