3D Delaminations


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

3D Delaminations

PBGA 3D Substrate Delamination - Application Note 2641

3D Delaminations

Sample & Method

A plastic BGA substrate, imaged as an acoustic solid by the 3V module.


The acoustic solid has been tilted and rotated. The lower left quadrant has been electronically sectioned to reveal details at the internal interfaces of the substrate. The lighter circular feature at the lower left is a large delamination between layers in the substrate.

For a planar view of the same sample, see Application Note #2535.