3V Voids and Cracks


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

3V Voids and Cracks

Ceramic Cutting Tool Voids and Cracks - Application Note 2470

3V Voids and Cracks

Sample & Method

This disk was imaged by Sonoscan’s 3V technique to produce an acoustic solid that could then be manipulated. A 3V image is made by scanning a sample several times at increasing depths, and by assembling all of the resulting planar scans into a 3-dimensional acoustic solid.


The resulting 3V image of this sample shows the tilted disk with two artificial planes that have been added to serve as reference points. The bulk diamond without defects sends back no return signal to the transducer and therefore appears transparent, as can be seen in most of the top half of the image.

Features of interest:

  • The bottom surface of the disk contains dimples that promote adhesion of the disk. Many of the lumpy features at the bottom of the disk are these dimples.
  • There are also voids, particularly in the bottom half of the disk. Some of these are mixed with the dimples, but some are free in the ceramic and “float” above the dimples.
  • The large feature at upper right is an internal crack in the diamond.