Voids and Delaminations


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

Voids and Delaminations

Ceramic Chip Capacitor Acoustic Microscope Image and Cross-Section - Application Note 2083

Voids and Delaminations

Sample & Method

A set of five multilayer ceramic chip capacitors were imaged on the C-SAM instrument using a 50 MHz, ½” focal length transducer. The echoes were gated to include the bulk, active area of the capacitor between the top and back surfaces. Correlative Acoustically Guided – Destructive Physical Analysis (AG-DPA) was also performed on Part #5 to further characterize the presence of defects.


Bright white areas within the boundary of each capacitor in the image indicate voids and delaminations within the capacitors. Large termination-to-termination delaminations are evident in Parts 1, 2 and 5. Voids are evident in all of the parts.

The full view (right) AG-DPA image shows the visual evidence of a portion of the large termination-to-termination delamination.