Die and Lead Delaminations


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

Die and Lead Delaminations

SOIC Die and Lead Delamination - Application Note 1086

Die and Lead Delaminations
Acoustic image of a SOIC showing delaminations (red), Diagram of a SOIC

Sample & Method

This SOIC, taken from a failed consumer product, was imaged from the top on C-SAM with gating on the die face, lead frame and paddle around the die.


The numerous red and yellow areas are delaminations of the molding compound from both the die face and the lead fingers. Each of these delaminations is a site where contamination and corrosion leading to electrical failure may occur. In addition, delamination near a wire bond can lead to separation of the interconnect wire from the bond pad.