PDIP Delaminations on the backside
PDIP Delaminations on the backside - Application Note 1053
Sample & Method
This PDIP (Plastic Dual In-line Package) was imaged at 15 MHz from the back side of the package. Gating was on the interface between the molding compound and the lead frame and paddle.
The small red areas are delaminations between the back side of the lead fingers and the molding compound. Delaminations in these areas encourage the collection of moisture and contaminants and the initiation of corrosion.