Voids and Bond Defects


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

Voids and Bond Defects

Flip Chip Underfill Void and Solder Bump Defects - Application Note 1016

Voids and Bond Defects

Sample & Method

Part of a Flip Chip development project, this package was imaged by C-SAM ® through the substrate side. Gating was on the interface between the cured underfill and the substrate, and includes the bonding of the solder balls to their pads.


Red areas are large voids in the underfill. In addition, the area of bond of the solder balls (white) is in many instances incomplete, indicating that these solder balls are only partially bonded.