TSOP Cracked Die


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

TSOP Cracked Die

TSOP Cracked Die - Application Note 759

TSOP Cracked Die
Optical image of a TSOP, Full JEDEC tray, Acoustic Image showing zoomed area of JEDEC tray

Sample & Method

JEDEC trays of plastic TSOPs were imaged with the automated FACTS2 system (top right image). Each tray held 60 devices. Gating was on the die.


There are no molding compound to die surface delaminations in the samples. However, many die are cracked at the mid-point (dark vertical line), probably as a result of improper handling. The magnified portion of the whole-tray image shows the details.