CSP Voids


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

CSP Voids

CSP Voids - Application Note 543

CSP Voids
CSP packages, voids are shown in red

Sample & Method

The die in this CSP is positioned face down. The package was imaged through the back of the die and focused at the

front side.


Below the face of the die is an elastomer layer. Voids (red) are between the elastomer and the face of the die.