Sectioned 3D AMI


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

Sectioned 3D AMI

Smart Card 3D Acoustic Microscope Image Sectioned - Application Note 453

Sectioned 3D AMI
3D Acoustic image of a smart card, Optical image

Sample & Method

The sample is the same contact-type smart card shown in Application Note # 452. Here, 3V software has been used to section the Acoustic Solid representing the smart card. Sectioning is geometric; a 3-dimensional corner has been removed to reveal the die attach and the bond pads. 3V sectioning may also be done by removing individual slices or according to the acoustic properties of materials.


The die attach area shows some non-uniformity that is probably not a reliability concern. Similar non-uniformity would be more serious in a device exposed to thermal cycling. The second bond pad from the left, however, appears to have no wire bonded to it.