TSOP Die Cracks


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

TSOP Die Cracks

TSOP Die Cracks - Application Note 309

TSOP Die Cracks
Optical image of a TSOP, diagram showing defect, Acoustic image of large crack, Acoustic image showing a smaller crack.

Sample & Method

Two TSOPs were imaged on C-SAM from the top side. Gating was at the interface between the die and the die attach layer.


Both examples exhibit cracks in the die. The die crack in the package at lower left above is large and complex; the crack at the center of the package at lower right above is much smaller. The location of both cracks in the center of the die suggests that they may have been caused by handling. Both packages also have extensive, mostly peripheral, voids (white areas) in the die attach material.