Smart Card Cracked Die


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

Smart Card Cracked Die

Smart Card Cracked Die - Application Note 306

Smart Card Cracked Die
Acoustic image left, showing a cracked die

Sample & Method

A region of a non-contact style Smart Card was imaged on C-SAM from the die face side of the card.


  • The die in this Smart card has been cracked and the symmetry of the crack suggests that the cracking occurred as a result of improper handling during assembly.
  • Acoustically, die cracks are, like many internal defects, gap-type defects. Unlike many other defects die cracks are usually vertical.
  • Die in numerous package types sometimes show smaller cracks, often as small, thin acoustic features. It is not uncommon for packages having small cracks to pass the manufacturer's electrical tests, since the crack has not yet had time to expand to the point where it will reach and disrupt the active circuitry on the face of the die.