PQFP Die Attach


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

PQFP Die Attach

PQFP Die Attach - Application Note 148

Sample & Method

A PQFP was imaged from the top side at a frequency of 15 MHz. Gating was on the die attach.


The yellow central area is die attach material. The red area is an extensive delamination where the die attach material is not bonded to the die above. Delaminations, whether large or small, are sites where moisture is likely to collect. Heat can cause the moisture to expand, further enlarging the delamination.