AMI Overview


Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

AMI Overview

The Value of C-SAM® Acoustic Micro Imaging (AMI)

Accurate and Non-destructive

Through the use of ultra-high frequency ultrasound, AMI non-destructively finds and characterizes physical defects—such as cracks, voids, delaminations and porosity— that occur during manufacturing, environmental testing or even under normal component operation. Because of the unique aspects of the technology, AMI can locate these defects better than any other inspection method.

Highly Sensitive

As it travels into a sample, an ultrasonic wave is either absorbed, scattered or reflected. It is highly sensitive to the elastic properties of the materials it travels through, and is especially sensitive to air gaps. This makes AMI the preferred method for finding delaminations, cracks, voids and porosity.

Layer by Layer Capabilities

The ultrasonic wave can also be positioned to inspect the sample at various depths. Therefore, unlike other inspection methods, Sonoscan C-SAM® technology allows for the visualization of interior features, and has the ability to produce images on a layer-by-layer basis.

Determines Material Properties

In addition to providing acoustic images of features and defects at various depths within a sample, Sonoscan’s C-SAM® technology is often utilized for determining material properties such as acoustic impedance, velocity and attenuation. By determining these properties a material may be more completely analyzed.