TurboSpeed™

Flip Chip
300 MHz image showing void (red) in underfill.

Nepcon Korea 2019
May 15-17
3H Booth No. A121,
Hall C & D COEX Exhibition Center,
South Korea

ECTC
May 29-30
509
Las Vegas, NV

MD&M East
June 11-13
1251
New York, NY

Sensors Expo
June 26-27
639
San Jose, CA

IPFA (24th IEEE Int'l Symposium)
July 2-5
China

Semicon West
July 9-11
San Francisco, CA

Advancements in Thermal Management
August 8-9
Denver, CO

Provides faster imaging speeds at high frequencies with up to 2.5X increased image acquisition speed (less time) at high pixel densities.