IMAPS Device Packaging
March 4-7
23
Fountain Hills, AZ
APEC (Power Electronics)
March 17-21
857
Anaheim, CA
Semicon China
March 20-22
Shanghai
Advanced Users Workshop - EGV
April 10-12
Elk Grove Village, IL
Thermal Materials Summit
May 2
Los Angeles, CA
Semicon SouthEast Asia
May 7-9
811
Kuala Lumpur, MY
SMT Hybrid
May 7-9
Nuremburg, Germany
Nepcon Korea
May 15-17
Seoul, Korea
ECTC
May 29-30
509
Las Vegas, NV
MD&M East
June 11-13
1251
New York, NY
Sensors Expo
June 26-27
639
San Jose, CA
IPFA (24th IEEE Int'l Symposium)
July 2-5
China
Semicon West
July 9-11
San Francisco, CA
Advancements in Thermal Management
August 8-9
Denver, CO
Provides faster imaging speeds at high frequencies with up to 2.5X increased image acquisition speed (less time) at high pixel densities.
