Inertial-Balanced Scanning Mechanisms

Flip Chip
300 MHz image showing void (red) in underfill.

Nepcon Korea
(3H Booth)
April 11-13 Seoul

Expo Electronica (Ostec Booth)
April 17-19
Moscow

Semicon SouthEast Asia (Crest Booth)
May 8-10
Kuala Lumpur, MY

MiNaPad Paris (Metronelec Booth)
May 16-17
Paris, France

Medical Wearables Tabletop
May 16-17,
Santa Clara, CA

ECTC
May 29-June 1,
San Diego, CA

Enova Toulouse (Metronelec Booth)
May 30-31
Toulouse, France

SMT Hybrid (Nordson and Fraunhaufer Booths)
June 5-7
Nuremberg, Germany

MD&M East
June 12-14,
New York, NY

Semicon West
July 10-12,
San Francisco, CA

Allow for very high speed, vibration-free scanning.