Inertial-Balanced Scanning Mechanisms

Flip Chip
300 MHz image showing void (red) in underfill.

IMAPS Device Packaging
March 4-7
23
Fountain Hills, AZ

APEC (Power Electronics)
March 17-21
857
Anaheim, CA

Semicon China
March 20-22
Shanghai

Advanced Users Workshop - EGV
April 10-12
Elk Grove Village, IL

Thermal Materials Summit
May 2
Los Angeles, CA

Semicon SouthEast Asia
May 7-9
811
Kuala Lumpur, MY

SMT Hybrid
May 7-9
Nuremburg, Germany

Nepcon Korea
May 15-17
Seoul, Korea

ECTC
May 29-30
509
Las Vegas, NV

MD&M East
June 11-13
1251
New York, NY

Sensors Expo
June 26-27
639
San Jose, CA

IPFA (24th IEEE Int'l Symposium)
July 2-5
China

Semicon West
July 9-11
San Francisco, CA

Advancements in Thermal Management
August 8-9
Denver, CO

Allow for very high speed, vibration-free scanning.