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ME—Ceramic Chip Capacitor
Internal defects such as delaminations, cracks and voids within ceramic chip capacitors can lead to product failure.

Sonoscan Automates Inspection of IGBT Modules

Elk Grove Village, IL — January 15, 2015

Power IGBT modules having voids and other internal structural defects are a problem for makers and users of the modules. These defects can block heat dissipation and cause electrical failure.

Sonoscan has now developed and is shipping a fully automated Acoustic Micro Imaging system that images and analyzes these module defects.

The C-SAM® model DF2400Z incorporates Sonoscan’s inverted transducer, placed beneath the module to prevent water from reaching module circuitry. There is no need for human attention. Once your recipe for scanning has been defined, the factory automation interface controls the operation step by step: 
         

  • a conveyor loads two IGBT modules onto the two (for high throughput) system stages.
  • the two ultrasonic transducers, one for each stage, raster-scan each module. Ultrasound is pulsed into the module and echo signals are received from gap-type defects at the depths of interest.
  • at the conclusion of scanning, accepts and rejects are stacked in separate locations.

The accept/reject criteria are written by the user of the system. Early users of the system are chiefly searching for voids, delaminations and non-bonds in the solder layer, because these defects are frequent causes of failure. But all depths within the module can be imaged separately in a single scan, if desired, with no change in throughput speed.

Because imaging is typically carried out before encapsulation of the modules, the acoustic images reveal what type of rework is needed on rejects. In addition to finding gap-type defects at any level, the system can also image tilting and warping of module elements such as rafts.

Acoustic image gated on IGBT module's solder layer reveals numerous heat-blocking voids (red).

Download the PDF announcement


Sonoscan, Inc. 2149 E. Pratt Blvd., Elk Grove Village, IL 60007. Phone 847-437-6400. Contact Bill Zuckerman x237. Email bzuckerman@sonoscan.com; web www.sonoscan.com.

About Sonoscan®: Sonoscan is the leading developer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems, widely used for nondestructive analysis of defects in industrial products and semiconductor devices. For over 30 years, Sonoscan’s attention to customer needs and investment in R&D has created systems that set industry standards for speed and accuracy. Key products include C-SAM® systems for off-line and laboratory analysis and FACTS2™ for automated production inspection.

Through its SonoLab division Sonoscan applications engineers, with experience totaling more than two centuries in acoustic microscopy, assist hundreds of customers annually in solving materials problems and quality control issues. SonoLab operates applications testing laboratories in multiple global locations to serve the inspection needs of customers that do not have their own capability.