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Pictured

ME—Ceramic Chip Capacitor
Internal defects such as delaminations, cracks and voids within ceramic chip capacitors can lead to product failure.

Sonoscan Introduces Acoustic Profiling Module

Elk Grove Village, IL — March 24, 2008

Sonoscan has introduced a new capability for its line of C - SAM acoustic microscopes that reveals the external surface topography of a device at the same time as its internal features.  Known as the Acoustic Surface Profile (ASP) module, this important mode can be used to measure warpage of plastic integrated circuits, flip chips, substrates, circuit boards, etc., without any sample preparation.

ASP is available as a cost effective option on new C-SAM acoustic microscope systems as well as a retrofit to many systems acquired over the last few years.  ASP works by collecting acoustic surface data and displaying it as a color-coded image in which each color corresponds to a topographical distance measurement.  The sensitivity of the ASP is in the micron range and is not dependant upon the surface smoothness, color or optical characteristics.

Warpage at the surface of a part is often associated with internal problems such as cracks and delaminations that can cause electrical failures. For example, the surface profile of a plastic-encapsulated IC may show warpage in one quadrant. Internally, the same quadrant may reveal lead-frame delaminations. Having both images makes it easier to identify the processes that are causing the problem.

The value of ASP is that it displays both the surface profile and the internal features on a single instrument, eliminates the need to buy a second instrument, and requires no additional scanning time, as the profile data is taken at the same time as the acoustic image data.   If a part is tilted, ASP corrects for tilt before profiling the surface.

For more information, contact Steve Martell, manager of technical support services.

Planar acoustic image of BGA (left) reveals multiple anomalies (yellow, dark gray) between molding compound and substrate around the periphery of the component. Acoustic Surface Profile (right) shows that the vertical warpage from the center of the part to the corners is 125 microns. Contamination gives this delamination two colors in the C-SAM acoustic image: red = air, white = fluid contaminant.

Sonoscan, Inc. 2149 E. Pratt Blvd., Elk Grove Village, IL 60007. Phone 847-437-6400. Contact Bill Zuckerman x237. Email bzuckerman@sonoscan.com; web www.sonoscan.com.

About Sonoscan®: Sonoscan is the leading developer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems, widely used for nondestructive analysis of defects in industrial products and semiconductor devices. For over 30 years, Sonoscan’s attention to customer needs and investment in R&D has created systems that set industry standards for speed and accuracy. Key products include C-SAM® systems for off-line and laboratory analysis and FACTS2™ for automated production inspection.

Through its SonoLab division Sonoscan applications engineers, with experience totaling more than two centuries in acoustic microscopy, assist hundreds of customers annually in solving materials problems and quality control issues. SonoLab operates applications testing laboratories in multiple global locations to serve the inspection needs of customers that do not have their own capability.