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Sonoscan Announces Advanced Thickness Measurement Method

Elk Grove Village, IL — September 30, 2008

In a joint effort with a large component supplier to the cellular and video industries, Sonoscan has developed an acoustic micro imaging technique that accurately measures the thickness of the bondline of the heat spreader adhesive in advanced microprocessor assemblies, even when the bondline is so thin that individual echoes cannot be separated.

Internal thicknesses are typically measured by recording the time of an echo from the top of a layer and from the bottom of the same layer. The thickness of the bondline must be within a specific range (30 microns and 80 microns, for example) to avoid a loss of heat dissipation and consequent electrical failure. 

These dimensions are too thin for the relatively low acoustic frequencies used to penetrate the metal heat spreader. The waveforms of the two echoes merge into a single echo.

The solution is to use one echo from the bondline itself and a second reference echo to extract the thickness measurements needed.

This new technique is being used with Sonoscan’s automated FACTS2™ system, which carries trays of microprocessor assemblies. Bondline thickness measurements are taken at multiple points on each assembly in order to identify a process drift as soon as possible after attachment of the heat spreader.

For more information, contact Steve Martell, manager of technical support services. Phone: 847 437-6400 x 240

Sonoscans new technique for measuring critical bondline thickness.

Sonoscan, Inc. 2149 E. Pratt Blvd., Elk Grove Village, IL 60007. Phone 847-437-6400. Contact Bill Zuckerman x237. Email bzuckerman@sonoscan.com; web www.sonoscan.com.

About Sonoscan®: Sonoscan is the leading developer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems, widely used for nondestructive analysis of defects in industrial products and semiconductor devices. For over 30 years, Sonoscan’s attention to customer needs and investment in R&D has created systems that set industry standards for speed and accuracy. Key products include C-SAM® systems for off-line and laboratory analysis and FACTS2™ for automated production inspection.

Through its SonoLab division Sonoscan applications engineers, with experience totaling more than two centuries in acoustic microscopy, assist hundreds of customers annually in solving materials problems and quality control issues. SonoLab operates applications testing laboratories in multiple global locations to serve the inspection needs of customers that do not have their own capability.