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Internal defects such as delaminations, cracks and voids within ceramic chip capacitors can lead to product failure.

Sonoscan Shipping 2x Throughput 300 mm Wafer Scanner

Elk Grove Village, IL — April 12, 2011

Sonoscan has begun shipping its automated 300 mm bonded wafer inspection system that simultaneously scans two wafers and gives users double the throughput of other systems.

The system inspects wafer pairs intended for SOI, MEMS and other applications for 300 mm and 200 mm wafers, and bonded by virtually any method. It images disbonds, delaminations, voids and particles at the bond interface, and cracks at any depth.

Based on Sonoscan’s well-known C-SAM® acoustic microscope systems, the AW300™ also automates the entire inspection system from carrier attachment and wafer selection through aligning and acoustic imaging to drying and sorting.

A robotic arm feeds wafers from two load ports that accept either FOUP or FSOB carriers. Wafers are fed into either of two scanners.  To ensure maximum throughput, wafers are sequenced in a staging area where wafers are processed and temporarily stored.

The AW300 uses Sonoscan-made transducers (lenses) ranging from 100 MHz to 400 MHz.  All of Sonoscan’s UHF transducers are designed, manufactured and matched in-house to ensure optimum performance.

The AW300 is capable of imaging inter-wafer voids as small as 5 microns wide, and delaminations as thin as 100Å.  Scanning employs Sonoscan’s non-immersion Waterfall™ transducers and vacuum-assisted stages.

Analysis software automatically measures the percentage of bonded and unbonded interface between the two wafers, and the sizes and number of voids.  Accept/reject decisions are made automatically according to the user’s specific criteria.

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Sonoscan, Inc. 2149 E. Pratt Blvd., Elk Grove Village, IL 60007. Phone 847-437-6400. Contact Bill Zuckerman x237. Email bzuckerman@sonoscan.com; web www.sonoscan.com.

About Sonoscan®: Sonoscan is the leading developer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems, widely used for nondestructive analysis of defects in industrial products and semiconductor devices. For over 30 years, Sonoscan’s attention to customer needs and investment in R&D has created systems that set industry standards for speed and accuracy. Key products include C-SAM® systems for off-line and laboratory analysis and FACTS2™ for automated production inspection.

Through its SonoLab division Sonoscan applications engineers, with experience totaling more than two centuries in acoustic microscopy, assist hundreds of customers annually in solving materials problems and quality control issues. SonoLab operates applications testing laboratories in multiple global locations to serve the inspection needs of customers that do not have their own capability.