Die and Lead Delaminations
SOIC Die and Lead Delamination - Application Note 1086
Sample & Method
This SOIC, taken from a failed consumer product, was imaged from the top on C-SAM with gating on the die face, lead frame and paddle around the die.
The numerous red and yellow areas are delaminations of the molding compound from both the die face and the lead fingers. Each of these delaminations is a site where contamination and corrosion leading to electrical failure may occur. In addition, delamination near a wire bond can lead to separation of the interconnect wire from the bond pad.