Massive Voids

Pictured

Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

Massive Voids

Multi Chip Module (MCM) Die Attach Defects - Application Note 1046

Massive Voids
Acoustic die attach level scans

Sample & Method

A surface acoustic scan was performed of the entire MCM for reference. A surface scan uses only the first return echo, with minimal penetration into the sample. Individual components were then scanned at the die attach depth using a 230 MHz transducer.

Result

All three scanned components showed massive voids (red) within the die attach material.