Voids

Pictured

Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

Voids

Chip On Board Voids - Application Note 1020

Voids
Acoustic image of a COB void (red)

Sample & Method

Many smart cards and hand-held toys use the COB design, where the die is attached and wire bonded directly to the board, then overmolded. This COB was imaged by C-SAM® at an ultrasonic frequency of 15 MHz. Gating of the return echoes was on the die surface level.

Result

In this image, the red area is a void in contact with the interconnect wires along the edge of the die.