Acoustic Microscopy Application Notes

Pictured

Time Domain Imaging (TDI)™
Utilizes an echo (amplitude & polarity) arrival ‘time’ as a reference, such as standard A-Scan, B-Scan and C-Mode type images.

Acoustic Microscopy Application Notes

Plastic ICs/PEMs

0147
PQFP Die Cracks
0148
PQFP Die Attach
0202
PBGA 3D Acoustic Microscope Image
0206
PBGA 3D Cross-Sectioned Voids in Molding Compound
0210
PBGA 3D Sectioned Voids in Molding Compound
0245
PBGA Popcorn Crack
0299
PBGA Die Face Delaminations
0309
TSOP Die Cracks
0434
PQFPs Production Scanning
0759
TSOP Cracked Die
1009
PBGA Delaminations, Through Transmission
1011
PBGA Delaminations
1012
PBGA Popcorn Crack, Through Transmission
1020
Chip On Board Voids
1021
Chip On Board Voids, Through Transmission
1053
PDIP Lead Delaminations on Top
1054
PDIP Lead Delaminations on Bottom
1058
PLCC Lead Delaminations
1148
PQFP Heat Damage
1086
SOIC Die and Lead Delamination
2250
SOJ Lead and Paddle Delaminations
2515
Plastic Encapsulated Microcircuit (PEM) 3D Acoustic Microscope Image
2518
QFN Lead Delaminations
2535
PBGA Substrate Delaminations
2566
TQFP Die Surface Delaminations

Flex Circuit

0053
Flex Circuit Delaminations

Smart Card

0304
Smart Card Induction Coil
0305
Smart Card Induction Coil Defects
0306
Smart Card Cracked Die
0452
Smart Card 3D Acoustic Microscope Image
0453
Smart Card 3D Acoustic Microscope Image Sectioned

Bonded Wafers

0419
Bonded Wafer Delaminations and Voids
2575
Bonded Wafer Delaminations Caused by Contamination
2581
Bonded Wafer with Multiple Voids

Chip Scale Package

0540
CSP Delamination
0543
CSP Voids
0657
CSP Die Attach Delamination, Through Transmission

Flip Chip

0354
Flip Chip - Disbonded solder bumps and halo defects
0355
Flip Chip Heat Sink Attach
1016
Flip Chip Underfill Void and Solder Bump Defects
2271
Flip Chip Underfill Void
2466
Flip Chip Underfill Multiple Voids

Hybrid

1046
Multi Chip Module (MCM) Die Attach Defects
1066
Multi Chip Module (MCM) Direct Bond Copper Defects
2596
Plastic BGA
2600
PBGA MC to Substrate Delamination
2602
PBGA Virtual Cross-Section
2614
Plastic BGA

Ceramic

2082
Ceramic Chip Capacitor Voids and Delaminations
2083
Ceramic Chip Capacitor Acoustic Microscope Image and Cross-Section
2187
Ceramic Disc Voids
2417
Ceramic Chip Capacitor Large Voids
2470
Ceramic Cutting Tool Voids and Cracks
2641
PBGA 3D Substrate Delamination

Solar Cells

0900
Solar Panel Delaminations and Cracks
0901
Solar Cell to Metal Buss Bar Delaminations
0902
Solar Cell Buss Bar to Connector Box Defects
0903
Solar Cell to Patterned Metal Buss Bar Delaminations
0904
Solar Cell Concentrator Delaminations

Packaging, Seals

0800
Blister Pack Seal Voiding, Through Transmission
0801
Polymer Pouch Seal Integrity, Through Transmission
0802
Polymer Tub Seal Integrity
0810
Polymer Pouch Seal Voids, Through Transmission

Materials

1200
Titanium Bar Material Voids
1202
Molybdenum Plate Material Voiding
1203
Ceramic Material Voids and Virtual Cross-Section
1204
Polymer Coating to Aluminum Plate Delamination

Other

2158
Microfluidics Channel Defects
2299
Heat Sink to PCB Bond Defects
2479
PCB Internal Layers
2543
Diagnostic Medical Device PCB Interface Delaminations