Advanced Features

Pictured

Flip Chip
300 MHz image showing void (red) in underfill.

Advanced Features

WaterPlume™
Safely and efficiently tests products (i.e. IGBT Power Modules prior to encapsulation) using a non-immersion scanning configuration that keeps the top surface of a sample dry utilizing a column of water from underneath.
Waterfall Transducer™
Delivers fast scanning without requiring immersion, ideal for production scanning and moisture-sensitive devices.
SonoSimulator™
Simplifies the imaging of very complex electronic parts involving stacked die or similar structures containing multiple thin layers.
Acoustic Impedance Polarity Detector (AIPD)™
Delivers the most accurate defect detection, and reliably detects delaminations as thin as 200 Angstroms.
Digital Image Analyzer (DIA)™
Uses advanced algorithms to quantify the interface data and allows you to set accurate, automatic, accept/reject criteria.
Virtual Rescanning Mode (VRM)™
Collects and digitally stores comprehensive acoustic data enabling you to perform a complete analysis of a sample, even when it is no longer available.
Frequency Domain Imaging (FDI)™
Allows you to select any single frequency or a range of frequencies to capture and utilize for imaging. FDI brings out subtle details that are not easily detected with conventional pulse-echo methods (Time Domain Imaging).
Time Domain Imaging (TDI)™
Another way of expressing any image that utilizes “time” as a reference, such as standard A-Scan, B-Scan and C-Mode type images, which are all based on time.
Inertial-Balanced Scanning Mechanisms
Allow for very high speed, vibration-free scanning.
Quantitative B-Scan Analysis Mode (Q-BAM)™
Considered to be a “Virtual Cross-section” of the sample.
Proprietary Transducer Technology
Delivers imaging at ultra-high frequencies with application optimized transducers.
Simultaneous Transmission and Reflection Mode (STaR)™
Allows you to efficiently evaluate components in fewer scans.
TurboSpeed™
Provides faster imaging speeds at high frequencies with up to 2.5X increased image acquisition speed (less time) at high pixel densities.