Micro­electronics

Pictured

Solar—Concentrator
The key reliability issue is the proper transfer of the excess solar thermal energy, requiring a consistent bond between the solar cell and the heat sink.

Micro­electronics

  • Plastic Encapsulated Microcircuits
    • PBGAs
    • PLCCs, PQFPs, TSOPs, SOICs, TQFPs
    • J-STD-020, J-STD-035
    • NASA: PEM-INST-001
    • ESA/SCC Spec No.25200
  • Ceramic Chip Capacitors
    • Discoidals, Filters, MLCCs, etc.
    • Mil-PRF-123, 31033 & 49470
  • Die Attach
    • Mil-STD-883–Method 2030
  • Chip Scale Package (CSPs)
  • Flip Chips
  • Stacked Dies
  • Ball Grid Arrays (BGAs, CBGAs)
  • Tape Automated Bond (TAB)
    • Mil-STD-883–Method 2035
  • Hybrids, MCMs, SIPs
  • Flex Circuits
  • Printed Circuit Boards (PCB)
  • Smart Cards
  • Bonded Wafers
    • Direct, Anodic, Glass Frit, Intermediate layer
    • SEMI MS5
  • Thermo Electric Coolers (TECs)
  • Power Modules
  • Sensors

Hidden defects such as delaminations, cracks and voids within a microelectronic application can lead to catastrophic failure of the device. Sonoscan's Acoustic Micro Imaging has always been the most trusted technology for nondestructive inspection of microelectronics.

Tap or roll over the photos to see how they look with our instruments!

PQFP

Optical and acoustic images showing popcorn crack defect.

PQFP

Optical and acoustic images showing die attach defects.

TSOP

Optical and acoustic images showing defects.

PDIP Group

Optical and acoustic images showing defects.

TQFP

Optical and acoustic images showing defects.

TQFP Group

Optical and acoustic images showing defects in a JEDEC tray scan.

PGA

Optical and acoustic images showing defects.

Ceramic Chip Capacitor

Optical and acoustic images showing defects.

Chip on Board (COB)

Optical and acoustic images showing die attach defects.

Smart Card

Optical and acoustic images showing die crack defects.

Smart Card

Optical and acoustic images showing demaminations.

Flip Chip

Optical and acoustic images showing underfill voids.

Hybrid

Optical and acoustic images showing underfill voids.

Flex Circuit (BGA)

Optical and acoustic images showing delaminations.

PCB

Optical and acoustic images showing defects on circuit board.

Bonded Wafer

Optical and acoustic images showing voids.

Ball Grid Array

Optical and acoustic images showing voids in the die attach.

Stacked Die

Optical and acoustic images showing cracks.

Thermo Electric Cooler

Optical and acoustic images showing voids.

Power Module

Optical and acoustic images showing voids and delaminations.

Metal PCB

Optical and acoustic images showing defects.